Samsung begins building 6 trillion won ($4.5 billion) memory-packaging plant

Samsung Electronics broke ground on 12 November 2026, on a 6 trillion won (about $4.5 billion) high-bandwidth memory chip-packaging plant in Asan, South Korea. The company has moved its target for starting the production line to June 2028, a year earlier than originally planned.

Samsung said it accelerated the schedule to meet rapidly growing demand for server memory, CNA Business said. The plant will have three floors of clean-room space covering about 31,000 square meters, the company said. Clean rooms are controlled spaces designed to limit contamination during manufacturing.

Plant is part of wider investment plan

At the groundbreaking, South Korean President Lee Jae Myung said he expected the plant investment to be followed by about 40 trillion won (about $29.9 billion) in advanced-equipment investment. That is Lee’s expectation of subsequent spending, not the amount Samsung has committed to the plant.

The project is part of plans Samsung affiliates announced in July 2026. South Korea’s industry ministry said Samsung Group had pledged 140 trillion won (about $104.7 billion) across the Chungcheong region for memory-chip fabrication and packaging, displays, package substrates and batteries. The pledge covers more than the Asan plant.

Samsung Group said it expected the wider regional investments to create about 250,000 jobs. The Asan production line remains scheduled to begin operating in June 2028.